高速晶片貼裝機
ASMPT SIPLACE CA
The most accurate chip shooter plus integrated die bonder with 10 µm at 3 σ
Integrated wafer presentation system
Supports SMT, flip chip (DCA) & die attach (COB) on a single platform
Enables high-volume production at the lowest Coo
Integrated wafer presentation system
Supports SMT, flip chip (DCA) & die attach (COB) on a single platform
Enables high-volume production at the lowest Coo
機器概況性能 Flip Chip Die Attach SMT
IPC 值/懸臂 10,500 cph 7,000 cph 20,000 cph
晶片/元件的规格(mm²) 0.5- 27.0 0.5 - 27.0 0201(公制) - 27.0
精度 ± 10 μm/3σ 2 ± 10 μm/3σ 2 ± 10 μm/3σ
IPC 值/懸臂 10,500 cph 7,000 cph 20,000 cph
晶片/元件的规格(mm²) 0.5- 27.0 0.5 - 27.0 0201(公制) - 27.0
精度 ± 10 μm/3σ 2 ± 10 μm/3σ 2 ± 10 μm/3σ