SAWA Plate cleaning machine
SAWA SC-ML736C
* A significant reduction in solvent consumption by 30%. Just put at least 18L of cleaning agent
* Cleaning + drying time is shortened to ensure cleaning efficiency
* Ultrasonic conduction + steel plate movement, increase the cleaning effect
* Ultrasound with a stable cleaning capacity
* Equipment is small and placed and used in space
* The operation mode is simple and easy for the operator to use
* The solvent is completely separated from the electrical control area without safety problems
* Oversized window steel plate cleaning process clear control
* Cleaning + drying time is shortened to ensure cleaning efficiency
* Ultrasonic conduction + steel plate movement, increase the cleaning effect
* Ultrasound with a stable cleaning capacity
* Equipment is small and placed and used in space
* The operation mode is simple and easy for the operator to use
* The solvent is completely separated from the electrical control area without safety problems
* Oversized window steel plate cleaning process clear control
Equipment Size: W1290 x D540 x H1460
Equipment weight: 137kg
Voltage: AC220V ± 10V 50/60 HV
Power consumption: 200VA
Cleaning method: Ultrasound
Ultrasonic power: 40kHz / 150W
Applicable steel plate size: Max 736mm x 736mm
Solvent capacity: Min 18L
Cleaning time: 3 Minute ~
Drying time: 5 minutes ~
For cleaning: BGA, QFP, Chip
Equipment weight: 137kg
Voltage: AC220V ± 10V 50/60 HV
Power consumption: 200VA
Cleaning method: Ultrasound
Ultrasonic power: 40kHz / 150W
Applicable steel plate size: Max 736mm x 736mm
Solvent capacity: Min 18L
Cleaning time: 3 Minute ~
Drying time: 5 minutes ~
For cleaning: BGA, QFP, Chip