SAWA Plate cleaning machine
SAWA SC-BM500E
* Corresponding to high density surface mount
* Ultrasonic + spray double cleaning effect
* A significant reduction in solvent consumption by 30%. Just put at least 18L of cleaning agent
* Easy to do from cleaning to dry one button to complete the operation
* Steel frame border and marginal can also be thoroughly cleaned
* Air conditioning system with standard compressed air
* Digital display, after, the remaining time at a glance
* Large transparent front window design, the cleaning process is clearly visible
* Equipment is small and placed and used in space
* The solvent is completely separated from the electrical control area without safety problems
* Suitable for semiconductor, packaging, precision electronics and other industries
* Ultrasonic + spray double cleaning effect
* A significant reduction in solvent consumption by 30%. Just put at least 18L of cleaning agent
* Easy to do from cleaning to dry one button to complete the operation
* Steel frame border and marginal can also be thoroughly cleaned
* Air conditioning system with standard compressed air
* Digital display, after, the remaining time at a glance
* Large transparent front window design, the cleaning process is clearly visible
* Equipment is small and placed and used in space
* The solvent is completely separated from the electrical control area without safety problems
* Suitable for semiconductor, packaging, precision electronics and other industries
Equipment dimensions: W1100 x D780 x H1790
Equipment weight: 240kg
Voltage: AC 100 ~ 240V 50/60 Hz
Power consumption: 550VA
Cleaning method: Ultrasonic + spray
Ultrasonic power: 40kHz / 300W
Applicable steel plate size (mm): 320 x 320 ~ 1000 x 740
Solvent capacity: Min 18L
Cleaning time: 1 minutes ~
Drying time: 14 minutes ~
For cleaning: BGA, QFP, Chip
Equipment weight: 240kg
Voltage: AC 100 ~ 240V 50/60 Hz
Power consumption: 550VA
Cleaning method: Ultrasonic + spray
Ultrasonic power: 40kHz / 300W
Applicable steel plate size (mm): 320 x 320 ~ 1000 x 740
Solvent capacity: Min 18L
Cleaning time: 1 minutes ~
Drying time: 14 minutes ~
For cleaning: BGA, QFP, Chip