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Wafer Transportation
Chip sorting
Multi-Panel Attaching
Screen Printing and Ball Placing and Wafer Coating
SPI
Glue Dispensing、Underfill
SolderBall Laser Bonding、Soldering
SolderBall Bonding、SolderBall Rework
Wafer、Flip Chip Placing
Reflow (nitrogen, vacuum, formic acid), pressure oven
AOI
3D X Ray
Wafer plating
SMT
PCB Multi-Panel Attaching
Bad Mark Scanning
Barcode Printing
Laser Marking
Screen Printing
Stencil Cleaning
SPI
Glue Dispensing、Coating
Chip Placing
Soldering and curing
AOI
PCB
Strip and Substrate Multi-Panel Attaching
Barcode Printing
Laser Marking
LED
Light Bar Multi-Panel Attaching
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Product
Semicon
SolderBall Laser Bonding、Soldering
Product
Semicon
Wafer Transportation (1)
Chip sorting (2)
Multi-Panel Attaching (1)
Screen Printing and Ball Placing and Wafer Coating (1)
SPI (2)
Glue Dispensing、Underfill (4)
SolderBall Laser Bonding、Soldering (2)
SolderBall Bonding、SolderBall Rework (2)
Wafer、Flip Chip Placing (2)
Reflow (nitrogen, vacuum, formic acid), pressure oven (6)
AOI (1)
3D X Ray (1)
Wafer plating (0)
SMT
PCB Multi-Panel Attaching (1)
Bad Mark Scanning (1)
Barcode Printing (1)
Laser Marking (3)
Screen Printing (2)
Stencil Cleaning (2)
SPI (3)
Glue Dispensing、Coating (4)
Chip Placing (1)
Soldering and curing (1)
AOI (1)
PCB
Strip and Substrate Multi-Panel Attaching (1)
Barcode Printing (1)
Laser Marking (1)
LED
Light Bar Multi-Panel Attaching (1)
Pactech SB2-Jet
Pactech SB2-SMS
