Inline solder ball repair machine
DTEK HS-R2
Product features
Visual inspection can be performed on the substrate of already installed components to identify situations such as multiple balls, few balls, and misalignment.
Based on the visual inspection results, it is possible to perform operations such as removing multiple missed balls and filling them in on the substrate, removing misaligned solder balls, and then re pointing Flux balls for planting.
Equipped with intelligent point flow function, it can accurately control the weight and amount of glue.
Equipped with a calibration platform, the position and height deviation of the head can be corrected at any time according to different production conditions.
Advantages Introduction
The online repair machine is a new concept non-contact ball planting repair system. The equipment's moving axis adopts a structure of linear motor and optical ruler positioning, which has the characteristics of fast speed and accurate positioning, allowing the detection CCD to accurately identify the position of each solder ball.
It uses a vacuum suction head to remove multiple balls and offset balls, and a planting ball head for rough filling of missed balls. It can be flexibly applied in various repair scenarios with good compatibility. All repair steps are completed by equipment automation, and it has the characteristics of high repair accuracy and good consistency of repaired products.
Visual inspection can be performed on the substrate of already installed components to identify situations such as multiple balls, few balls, and misalignment.
Based on the visual inspection results, it is possible to perform operations such as removing multiple missed balls and filling them in on the substrate, removing misaligned solder balls, and then re pointing Flux balls for planting.
Equipped with intelligent point flow function, it can accurately control the weight and amount of glue.
Equipped with a calibration platform, the position and height deviation of the head can be corrected at any time according to different production conditions.
Advantages Introduction
The online repair machine is a new concept non-contact ball planting repair system. The equipment's moving axis adopts a structure of linear motor and optical ruler positioning, which has the characteristics of fast speed and accurate positioning, allowing the detection CCD to accurately identify the position of each solder ball.
It uses a vacuum suction head to remove multiple balls and offset balls, and a planting ball head for rough filling of missed balls. It can be flexibly applied in various repair scenarios with good compatibility. All repair steps are completed by equipment automation, and it has the characteristics of high repair accuracy and good consistency of repaired products.
Machine size: 1050mm (W) x 1650mm (D) x 1650mm (H).
PCB size: 75 x 75mm~165 x 310mm, H: 0.1~5mm.
Track height: 900 ± 20 mm.
Substrate ball planting method: vacuum suction removal of tin balls+non-contact ball planting.
Can produce ball diameter: Φ 150 um~ Φ 760 um.
Planting accuracy: ≤ 1/4 of the diameter of the tin ball.
Soldering flux transfer method: Apply soldering flux to the dispensing valve.
Power supply: 220 VAC/50 Hz/8 KW.
Pressure demand:>0.6 Mpa.
Nitrogen pressure:>0.2 Mpa.
PCB size: 75 x 75mm~165 x 310mm, H: 0.1~5mm.
Track height: 900 ± 20 mm.
Substrate ball planting method: vacuum suction removal of tin balls+non-contact ball planting.
Can produce ball diameter: Φ 150 um~ Φ 760 um.
Planting accuracy: ≤ 1/4 of the diameter of the tin ball.
Soldering flux transfer method: Apply soldering flux to the dispensing valve.
Power supply: 220 VAC/50 Hz/8 KW.
Pressure demand:>0.6 Mpa.
Nitrogen pressure:>0.2 Mpa.