ASMPT DEK Galaxy
ASMPT DEK Galaxy
Ultimate performance
Galaxy embodies new mechanical properties, including linear motor technology to improve speed, accuracy and reliability, and brings advanced advanced technology including ProFlow® DirEKt imaging, as well as advanced optics for perfect optical inspection at high throughput And lighting equipment. The standard tool platform accepts all compatible fixture options, including array single substrates, as well as substrate and wafer level processing carrier standards. Further tooling options include Grid-Lok® or advanced surface mount technology pre-fixture for ultra-dense assembly. SMEMA compatible interface support with DEK wafer loading and substrate flux coating solutions, as well as back-end devices including raster array reflow and component placement devices.
Galaxy can show the ultimate performance, whether used alone or as part of the all-in-one process configured by the DEK experts.
Galaxy offers flexibility. Its vast capabilities and extensive compatibility, coupled with rapid product line replacement, create a process with a fast redistribution capability when the business needs dominate. DirEKt solder ball to the wafer or substrate, the ball diameter reduced to 0.2mm.
This level of integration brings advanced technical capabilities that are necessary for the next generation of packaging technology and assembly challenges.
Galaxy embodies new mechanical properties, including linear motor technology to improve speed, accuracy and reliability, and brings advanced advanced technology including ProFlow® DirEKt imaging, as well as advanced optics for perfect optical inspection at high throughput And lighting equipment. The standard tool platform accepts all compatible fixture options, including array single substrates, as well as substrate and wafer level processing carrier standards. Further tooling options include Grid-Lok® or advanced surface mount technology pre-fixture for ultra-dense assembly. SMEMA compatible interface support with DEK wafer loading and substrate flux coating solutions, as well as back-end devices including raster array reflow and component placement devices.
Galaxy can show the ultimate performance, whether used alone or as part of the all-in-one process configured by the DEK experts.
Galaxy offers flexibility. Its vast capabilities and extensive compatibility, coupled with rapid product line replacement, create a process with a fast redistribution capability when the business needs dominate. DirEKt solder ball to the wafer or substrate, the ball diameter reduced to 0.2mm.
This level of integration brings advanced technical capabilities that are necessary for the next generation of packaging technology and assembly challenges.
Device alignment accuracy ± 12.5 μm @ 2 Cmk
Process alignment accuracy ± 12.5 μm @ 2 Cmk
Device basic time 7 seconds (up to 4 seconds after using RTC)
Product conversion is less than 2 minutes
Compliant with semiconductor plant automation protocol SECS / GEM
Remote operation, monitoring and diagnostics
Linear motor technology for optimum speed and accuracy
Need to.
Process alignment accuracy ± 12.5 μm @ 2 Cmk
Device basic time 7 seconds (up to 4 seconds after using RTC)
Product conversion is less than 2 minutes
Compliant with semiconductor plant automation protocol SECS / GEM
Remote operation, monitoring and diagnostics
Linear motor technology for optimum speed and accuracy
Need to.