Vacuum Reflow

Heller offer vacuum reflow ovens with several different footprint and vacuum chamber size options, and are suitable for all volumes of production from R&D to HVM. To see how our vacuum reflow soldering ovens can help your process, email us at VacuumTest@hellerindustries.com for a free vacuum reflow demo and void analysis on your product.
●Low Void Rates
By utilizing a vacuum cycle during the reflow process, these vacuum reflow ovens are able to remove voids in solder joints and interfaces.
●Highest UPH
Our vacuum reflow ovens offer an optional staging conveyor for the fastest vacuum chamber transfer times. Dual rail conveyors are also available for additional throughput.
●No Shifting Parts
The smooth-travel conveyor system ensures that components are not shifted or moved during travel throughout the oven. Boards on conveyor experience minimal vibration during travel – including entering and exiting the vacuum chamber.
●No Solder or Flux Splatter
Our vacuum pumps offer closed-loop control for a controlled multi-step pump down and re-fill. This prevents yield-killing solder and flux splatter that can occur with single stage, open-loop vacuum systems offered by the competition.