Pressure Oven

HELLER's pressure oven is mainly used for chip mounting and glue filling processes; Can effectively eliminate bubble Void, increase the adhesion of chip mounting and filling adhesive; Using forced hot air convection heating, pressurizing and baking in a sealed container; After baking is completed, the pressure is automatically released and cooled.
Application of pressure curing:
• ABF resin lamination
• Resin plug/fill holes.
• Chip bonding.
• Bottom glue filling.
• Wafer bonding.
• Fill the holes.
• Film&Tape Bonding.