IntelliJet® Jetting System, and Canvas® software.
Asymtek Vantage ® Series
The Vantage® series of next-generation dispensing capabilities for precision packaging and assembly is designed for advanced semiconductor packaging,
MEMS and printed circuit board packaging. The new platform is particularly suitable for advanced packaging technologies involving high-speed precision dispensing, slit or precision fine line dispensing application packaging.
Paired with the IntelliJet ® jet dispensing system and ReadiSet ® jet module, the Vantage series brings users industry-leading stability and micro-dot jet dispensing technology with frequencies up to 1,000 Hz. The Vantage Series supports:
• IntelliJet jetting system for single- or dual-valve simultaneous dispensing .
• Higher throughput—dispensing frequency up to 1,000 Hz, capable of spraying 1,800,000 dots per hour.
• Narrow slit dispensing - the dispensing fluid width is less than 175 µm .
• Dispensing that meets the requirements of advanced wafer-level technology - the glue volume of a single point is less than 1.5 nL, which can meet the precise dispensing line path requirements.
• Closed-loop process control system - Equipped with automatic weighing closed-loop control system.
• Fast and repeatable setup - With automatic calibration function.
• Real-time correction technology - Used to compensate for the tilt of the substrate in the X, Y, Z axis directions.
• Small footprint and can be processed Large substrates • Advanced Canvas dispensing software.
MEMS and printed circuit board packaging. The new platform is particularly suitable for advanced packaging technologies involving high-speed precision dispensing, slit or precision fine line dispensing application packaging.
Paired with the IntelliJet ® jet dispensing system and ReadiSet ® jet module, the Vantage series brings users industry-leading stability and micro-dot jet dispensing technology with frequencies up to 1,000 Hz. The Vantage Series supports:
• IntelliJet jetting system for single- or dual-valve simultaneous dispensing .
• Higher throughput—dispensing frequency up to 1,000 Hz, capable of spraying 1,800,000 dots per hour.
• Narrow slit dispensing - the dispensing fluid width is less than 175 µm .
• Dispensing that meets the requirements of advanced wafer-level technology - the glue volume of a single point is less than 1.5 nL, which can meet the precise dispensing line path requirements.
• Closed-loop process control system - Equipped with automatic weighing closed-loop control system.
• Fast and repeatable setup - With automatic calibration function.
• Real-time correction technology - Used to compensate for the tilt of the substrate in the X, Y, Z axis directions.
• Small footprint and can be processed Large substrates • Advanced Canvas dispensing software.
●Dispensing area (XY)
Single-valve dispensing range 470 x 475 mm
Double-valve dispensing range 346 x 475 mm
●The motion system has a dispensing frequency of up to 1,000 Hz and can spray 1,800,000 glue dots per hour.
Dispensing fluid width is less than 175 µm.
Single point is less than 1.5 nL glue volume
Single-valve dispensing range 470 x 475 mm
Double-valve dispensing range 346 x 475 mm
●The motion system has a dispensing frequency of up to 1,000 Hz and can spray 1,800,000 glue dots per hour.
Dispensing fluid width is less than 175 µm.
Single point is less than 1.5 nL glue volume