IR Inspection A300
DTEK IR Inspection A300
Wafer Sorting
sorting Lister
◎ side chipping (崩缺)
◎ Chip crack (龜裂)
◎ Chip position (偏移)
◎ Die Tilt (傾斜)
◎ Chip Lifted (脫落)
◎ Die Rotation (歪斜)
◎ Epoxy on chip (殘膠)
◎ Die scratch (刮傷)
◎ IR 穿透檢視
◎ Barcode Reader 讀取
sorting Lister
◎ side chipping (崩缺)
◎ Chip crack (龜裂)
◎ Chip position (偏移)
◎ Die Tilt (傾斜)
◎ Chip Lifted (脫落)
◎ Die Rotation (歪斜)
◎ Epoxy on chip (殘膠)
◎ Die scratch (刮傷)
◎ IR 穿透檢視
◎ Barcode Reader 讀取
IR Inspection capacity ≧ 3000 pcs / hrs
IR detection accuracy ± 3um at 3σ
IR detection capability of silicon. Arsenic (currently known to be detectable)
IR wavelength 900 ~ 1700nm
Pixel Size 15umX15um
Resolution 640X512 Pixel
Operating Temp -40 ℃ ~ + 70 ℃
Institutional platform part
X / Y axis part X: granite platform
Y: granite stone
Machine size 1000x1300x1765 mm
Input 220V AC 50/60 Hz 3P
Full load Current 25A
Pressure 5 to 8 Bar (3 CFM @ 100 psi)
IR detection accuracy ± 3um at 3σ
IR detection capability of silicon. Arsenic (currently known to be detectable)
IR wavelength 900 ~ 1700nm
Pixel Size 15umX15um
Resolution 640X512 Pixel
Operating Temp -40 ℃ ~ + 70 ℃
Institutional platform part
X / Y axis part X: granite platform
Y: granite stone
Machine size 1000x1300x1765 mm
Input 220V AC 50/60 Hz 3P
Full load Current 25A
Pressure 5 to 8 Bar (3 CFM @ 100 psi)